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三时纪用新技术为客户创造价值
TAT USE NEW TECHNOLOGY
TO CREATE VALUE FOR CUSTOMERS

TAT是全球首家将聚硅氧烷微球及其衍生二氧化硅进行开发并在半导体封装、电子密封胶及5G通信行业中应用的企业。随着社会的发展和技术的进步,新的需求被不断的提出。我们对行业未来发展有深刻的洞察力并创造新材料开发新技术,解决现有技术和材料的不能满足需求的难题。 我们的产品在现实生活中虽然不被直接看到,但却是智能手机、电脑、智能驾驶、将来智慧世界万物互联等系统中不可缺少的关键材料。

TAT is the first company in the world to develop polysiloxane microspheres and their derived silica and apply them in semiconductor packaging, electronic sealant and 5G communication industry. With the development of society and the progress of technology, new needs are constantly put forward. We have deep insight into the future development of the industry and create new materials, develop new technology, and solve the problems that existing technology and materials can not meet the demand. Although our products are not directly seen in real life, they are indispensable key materials in smart phones, computers, intelligent driving, interconnection of all things in the “intelligent world” and other systems in the future.

技术和材料
NEW TECHNOLOGY AND NEW MATERIAL

TAT 的产品粒径覆盖 50nm 到 20μm 范围(未来可到 100μm),粒度分布窄,具有一样粒径,颗粒表面光滑

The product particle size of TAT covers 50 nm to 20μm range (up to 100μm in the future) , the particle size 

distribution is narrow, with the same particle size, and the particle surface is smooth。

球形硅微粉,硅微粉厂家,合成硅微粉,三时纪

TAT合成法的特点
CHARACTERISTICS
OF TAT
SYNTHESIS

球形硅微粉,硅微粉厂家,合成硅微粉,三时纪

  • 球形度高,表面光滑,内部无中空
    High sphericity, smooth surface, no hollow inside.
  • 粒度可控范围大
    Large controllable range of particle size.
  • 粒度分布的窄宽可控
    particle size distribution is controllable.narrow or broad
  • 因为是湿法工艺可使用湿法高精度卡段
    Because it is a wet process, it can use wet high-precision top cut.
  • 可在球形二氧化硅内部导入碳原子
    Carbon atoms can be introduced into spherical silica.
  • The Only Technology
    专有技术
    PROPRIETARYTECHNOLOGY
  • 全粒径段无中空球硅 (适合于需要抛光的封装工艺INFO, CoWoS,X-Cube,FOVEROS)
    There is no hollow Spherical Silica in the full size section(Suitable for packaging processes that require polishing INFO,CoWoS,X-Cube,FOVEROS
  • 含碳原子球硅(半导体封装材料填料的全新概念:可实 现二氧化硅的激光可加工性;解决封装材料的导电性乙 炔黑着色化。
    Spherical Silica containing carbon atoms(The new concept of semiconductor packaging material filler:Can realize laser process-ability of silica;Solve the conductivity problem of vinyl black coloring of packaging materials
  • 紧密填充DY级配球硅(适合于需要高窄空隙填充性的封装 工艺MUF)
    Closest packing with monodisperse PSD spherical silica as first ball (Suitable for packaging process MUF requiring high and narrow space filling)
  • TAT在半导体封装材料里的应用技术
    TAT'S APPLICATION TECHNOLOGY
    IN SEMICONDUCTOR PACKAGING AREA
    高填充技术(DY 级配球硅)High packing technology (DY Closest Packing)

    由于TAT的合成球硅的粒度分布的宽窄可以控制,粗粉一级球可选择单分布的球硅。用单一分散粗粉进行级配可以满足既要卡段粒径小又要频径大来降低粘度的现代先端半导体封装的需求。这种级配在业内是首创,DY级配球硅在MUF,INFO,2.5D,3D等先端半导体封装材料里的应用前景可观。

    Because the particle size distribution of TAT synthetic spherical silica can be controlled, the coarse powder first sphere canchoose single distribution spherical silica. Grading with single dispersed coarse powder can meet the needs of modernadvanced semiconductor packa ging, which requires both small particle size and large most frequency size to reduceviscosity. This grading is the first in the industry. DY graded spherical silica has a promising application prospect in substrate,MUF,info, 2.5D, 3D and other advanced semiconductor packaging materials.


    球形硅微粉,硅微粉厂家,合成硅微粉,三时纪

    粉体卡断技术Powder fine upper cut technology

    在合成工艺段控制粒度分布、对粗大颗粒生成的抑制是TAT卡断技术的基础。TAT合成球硅工艺能控制粒度分布,除去大颗粒。

    Controlling particle size distribution and inhibiting the formation of coarse particles in the synthesis process section are the basis of TAT Powder fine upper cut technology.TAT synthesis process can control the particle size distribution and remove coarse particles.

    表面处理技术Surface Treatment Technology

    表面处理处理的关键是:1)处理均一,2)更重要的是不能产生结团。

    The key of surface treatment is: 1) uniform treatment, 2) more importantly, no agglomeration. 

  • Mode(μm)0.1
    SSA(m2/g)30.0
    Maximum
    particle size(μm)
    Top cut size(μm):
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Golden Wide Distribution
    Description
  • Mode(μm)0.3
    SSA(m2/g)10.0
    Maximum
    particle size(μm)
    Top cut size(μm):
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Golden Wide Distribution
    Description
  • Mode(μm)0.6
    SSA(m2/g)5.5
    Maximum
    particle size(μm)
    Top cut size(μm):
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Golden Wide Distribution
    Description
  • Mode(μm)1.3
    SSA(m2/g)3.0
    Maximum
    particle size(μm)
    Top cut size(μm):
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Golden Wide Distribution
    Description
  • Mode(μm)2.4
    SSA(m2/g)1.5
    Maximum
    particle size(μm)
    Top cut size(μm):
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Narrow Distribution
    Description
  • Mode(μm)5.0
    SSA(m2/g)0.6
    Maximum
    particle size(μm)
    Top cut size(μm):
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Narrow Distribution
    Description
  • Mode(μm)8.0
    SSA(m2/g)0.4
    Maximum
    particle size(μm)
    Top cut size(μm):
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Narrow Distribution
    Description
  • Mode(μm)0.3
    SSA(m2/g)10.0
    Maximum
    particle size(μm)
    Top cut size(μm):5
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Golden Wide Distribution
    Description
  • Mode(μm)0.6
    SSA(m2/g)5.5
    Maximum
    particle size(μm)
    Top cut size(μm):5
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Golden Wide Distribution
    Description
  • Mode(μm)0.1
    SSA(m2/g)30.0
    Maximum
    particle size(μm)
    Top cut size(μm):5
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Golden Wide Distribution
    Description
  • Mode(μm)1.3
    SSA(m2/g)3.0
    Maximum
    particle size(μm)
    Top cut size(μm):5
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Golden Wide Distribution
    Description
  • Mode(μm)0.6
    SSA(m2/g)5.5
    Maximum
    particle size(μm)
    Top cut size(μm):10
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Golden Wide Distribution
    Description
  • Mode(μm)1.3
    SSA(m2/g)3.0
    Maximum
    particle size(μm)
    Top cut size(μm):10
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Golden Wide Distribution
    Description
  • Mode(μm)2.4
    SSA(m2/g)1.5
    Maximum
    particle size(μm)
    Top cut size(μm):10
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Narrow Distribution
    Description
  • Mode(μm)5.0
    SSA(m2/g)0.6
    Maximum
    particle size(μm)
    Top cut size(μm):10
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Narrow Distribution
    Description
  • Mode(μm)8.0
    SSA(m2/g)0.4
    Maximum
    particle size(μm)
    Top cut size(μm):15
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Narrow Distribution
    Description
  • Mode(μm)0.1
    SSA(m2/g)30.0
    Maximum
    particle size(μm)
    Top cut size(μm):5
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Golden Wide Distribution
    Description
  • Mode(μm)0.3
    SSA(m2/g)10.0
    Maximum
    particle size(μm)
    Top cut size(μm):5
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Golden Wide Distribution
    Description
  • Mode(μm)0.6
    SSA(m2/g)6.0
    Maximum
    particle size(μm)
    Top cut size(μm):5
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Golden Wide Distribution
    Description
  • Mode(μm)1.3
    SSA(m2/g)3.0
    Maximum
    particle size(μm)
    Top cut size(μm):5
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Golden Wide Distribution
    Description
  • Mode(μm)8.0
    SSA(m2/g)2.5
    Maximum
    particle size(μm)
    Top cut size(μm):15
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :DY Close Packing
    Description
  • Mode(μm)2.4
    SSA(m2/g)3.5
    Maximum
    particle size(μm)
    Top cut size(μm):5
    Surface Treatment :Yes
    Closest Packing:
    DY Closest packing:
    Description :DY Close Packing
    Description
  • Mode(μm)2.4
    SSA(m2/g)4.0
    Maximum
    particle size(μm)
    Top cut size(μm):5
    Surface Treatment :
    Closest Packing:
    DY Closest packing:
    Description :
    DescriptionUltra Close Packing
  • Mode(μm)5.0
    SSA(m2/g)3.5
    Maximum
    particle size(μm)
    Top cut size(μm):10
    Surface Treatment :
    Closest Packing:
    DY Closest packing:
    Description :
    DescriptionUltra Close Packing
  • Mode(μm)8.0
    SSA(m2/g)3.5
    Maximum
    particle size(μm)
    Top cut size(μm):15
    Surface Treatment :
    Closest Packing:
    DY Closest packing:
    Description :
    DescriptionUltra Close Packing
  • Mode(μm)15.0
    SSA(m2/g)2.5
    Maximum
    particle size(μm)
    Top cut size(μm):25
    Surface Treatment :
    Closest Packing:
    DY Closest packing:
    Description :
    DescriptionUltra Close Packing
  • Mode(μm)2.4
    SSA(m2/g)4.0
    Maximum
    particle size(μm)
    Top cut size(μm):5
    Surface Treatment :
    Closest Packing:
    DY Closest packing:
    Description :
    DescriptionUltra Close Packing
  • Mode(μm)5.0
    SSA(m2/g)3.5
    Maximum
    particle size(μm)
    Top cut size(μm):10
    Surface Treatment :
    Closest Packing:
    DY Closest packing:
    Description :
    DescriptionUltra Close Packing
  • Mode(μm)8.0
    SSA(m2/g)3.5
    Maximum
    particle size(μm)
    Top cut size(μm):15
    Surface Treatment :
    Closest Packing:
    DY Closest packing:
    Description :
    DescriptionUltra Close Packing
  • Mode(μm)15.0
    SSA(m2/g)2.5
    Maximum
    particle size(μm)
    Top cut size(μm):25
    Surface Treatment :
    Closest Packing:
    DY Closest packing:
    Description :
    DescriptionUltra Close Packing
  • Mode(μm)0.6
    SSA(m2/g)5.5
    Maximum
    particle size(μm)
    Top cut size(μm):45
    Surface Treatment :
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Golden Wide Distribution
    Description
  • Mode(μm)1.3
    SSA(m2/g)3.0
    Maximum
    particle size(μm)
    Top cut size(μm):45
    Surface Treatment :
    Closest Packing:
    DY Closest packing:
    Description :Monomer
    Golden Wide Distribution
    Description
  • Product application field
  • SEMI
    SEMI
  • PCB
    PCB
  • 消费电子
    消费电子
    Consumer electronics
    人工智能
    人工智能
    artificial intelligence
    智能汽车
    智能汽车
    Intelligent vehicle
    万物互联
    万物互联
    Interconnection of all things
    数据中心
    数据中心
    Data center
    底部联系
    新闻中心
    Contact us

    总务  电话:0572-2961695   邮箱:TAT@zjtat.com

    营业  电话:0572-2927659   手机:18806825925   邮箱:JASON@zjtat.com